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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| Factory Lead Time | 12 Weeks |
| Number of Ports | 4 |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Memory Width | 36 |
| Memory Interface | Parallel |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) |
| Height Seated (Max) | 1.2mm |
| JESD-609 Code | e1 |
| Output Characteristics | 3-STATE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Length | 15mm |
| Memory Type | Volatile |
| Clock Frequency | 200MHz |
| Memory Format | SRAM |
| Voltage – Supply | 3.135V~3.465V |
| Sync/Async | Synchronous |
| I/O Type | COMMON |
| Supply Voltage-Min (Vsup) | 3.135V |
| Number of Pins | 165 |
| Number of Terminations | 165 |
| Pin Count | 165 |
| Address Bus Width | 18b |
| Additional Feature | PIPELINED ARCHITECTURE |
| ECCN Code | 3A991.B.2.A |
| Technology | SRAM – Synchronous, SDR |
| Word Size | 36b |
| Package / Case | 165-TBGA |
| Density | 9 Mb |
| Memory Size | 9Mb 256K x 36 |
| Nominal Supply Current | 275mA |
| Organization | 256KX36 |
| Access Time | 3.1ns |
| Standby Current-Max | 0.105A |
*The following components have specifications similar
*The following five components have specifications similar
