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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Surface Mount | YES |
| Factory Lead Time | 12 Weeks |
| Packaging | Tray |
| Qualification Status | Not Qualified |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Supply Voltage | 1.8V |
| Power Supplies | 1.8V |
| Terminal Pitch | 1mm |
| Memory Width | 18 |
| Terminal Position | BOTTOM |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Height Seated (Max) | 1.4mm |
| Operating Temperature | 0°C~70°C TA |
| Output Characteristics | 3-STATE |
| Width | 15mm |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Supply Voltage-Min (Vsup) | 1.71V |
| Standby Voltage-Min | 1.7V |
| Length | 17mm |
| I/O Type | COMMON |
| Supply Voltage-Max (Vsup) | 1.89V |
| Number of Pins | 165 |
| Number of Terminations | 165 |
| Pin Count | 165 |
| Clock Frequency | 400MHz |
| Terminal Finish | TIN SILVER COPPER |
| HTS Code | 8542.32.00.41 |
| Additional Feature | PIPELINED ARCHITECTURE |
| ECCN Code | 3A991.B.2.A |
| Package / Case | 165-LBGA |
| Voltage – Supply | 1.71V~1.89V |
| Access Time (Max) | 0.45 ns |
| Memory Size | 36Mb 2M x 18 |
| Supply Current-Max | 0.75mA |
| Memory Density | 37748736 bit |
| Standby Current-Max | 0.32A |
| Organization | 2MX18 |
| Technology | SRAM – Synchronous, DDR IIP |
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