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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| ECCN Code | EAR99 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Packaging | Tray |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Memory Width | 9 |
| Factory Lead Time | 14 Weeks |
| Supply Voltage | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| Memory Type | Volatile |
| Width | 11mm |
| Supply Voltage-Min (Vsup) | 1.7V |
| Number of Terminations | 144 |
| Operating Mode | SYNCHRONOUS |
| Supply Voltage-Max (Vsup) | 1.9V |
| Memory Format | DRAM |
| Clock Frequency | 300MHz |
| Voltage – Supply | 1.7V~1.9V |
| Access Time | 20ns |
| Length | 18.5mm |
| Additional Feature | AUTO REFRESH |
| Memory Density | 301989888 bit |
| JESD-30 Code | R-PBGA-B144 |
| Package / Case | 144-TBGA |
| Memory Size | 288Mb 32M x 9 |
| Organization | 32MX9 |
*The following components have specifications similar
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