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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Packaging | Tray |
| Memory Width | 16 |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Factory Lead Time | 14 Weeks |
| Supply Voltage | 1.8V |
| Operating Supply Voltage | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Length | 10mm |
| Terminal Position | BOTTOM |
| Number of Pins | 60 |
| Number of Terminations | 60 |
| Pin Count | 60 |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Output Characteristics | 3-STATE |
| Height Seated (Max) | 1.1mm |
| Memory Type | Volatile |
| Supply Voltage-Min (Vsup) | 1.7V |
| Screening Level | AEC-Q100 |
| Data Bus Width | 16b |
| I/O Type | COMMON |
| Memory Format | DRAM |
| Clock Frequency | 166MHz |
| Nominal Supply Current | 110mA |
| Refresh Cycles | 8192 |
| Terminal Finish | TIN SILVER COPPER |
| Supply Voltage-Max (Vsup) | 1.95V |
| Write Cycle Time – Word, Page | 12ns |
| Additional Feature | AUTO/SELF REFRESH |
| Standby Current-Max | 0.00001A |
| Voltage – Supply | 1.7V~1.95V |
| Address Bus Width | 15b |
| Memory Size | 512Mb 32M x 16 |
| Access Time | 5.5ns |
| Package / Case | 60-TFBGA |
| Organization | 32MX16 |
| Density | 512 Mb |
| Technology | SDRAM – Mobile LPDDR |
| HTS Code | 8542.32.00.28 |
| Interleaved Burst Length | 24816 |
| Sequential Burst Length | 24816 |
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