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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
ECCN Code | EAR99 |
Pbfree Code | yes |
Packaging | Tray |
Qualification Status | Not Qualified |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 40 |
Factory Lead Time | 14 Weeks |
Supply Voltage | 1.8V |
Operating Supply Voltage | 1.8V |
Memory Width | 32 |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
Height Seated (Max) | 1.2mm |
JESD-609 Code | e1 |
Operating Temperature | 0°C~70°C TA |
Output Characteristics | 3-STATE |
Memory Type | Volatile |
Number of Terminations | 90 |
Number of Pins | 90 |
Pin Count | 90 |
Supply Voltage-Min (Vsup) | 1.7V |
Length | 13mm |
Data Bus Width | 32b |
Operating Mode | SYNCHRONOUS |
I/O Type | COMMON |
Memory Format | DRAM |
Clock Frequency | 166MHz |
Nominal Supply Current | 110mA |
Refresh Cycles | 8192 |
Terminal Finish | TIN SILVER COPPER |
Supply Voltage-Max (Vsup) | 1.95V |
Write Cycle Time – Word, Page | 12ns |
Additional Feature | AUTO/SELF REFRESH |
Standby Current-Max | 0.00001A |
Voltage – Supply | 1.7V~1.95V |
Address Bus Width | 15b |
Access Time | 5.5ns |
Density | 512 Mb |
Technology | SDRAM – Mobile LPDDR |
Package / Case | 90-TFBGA |
HTS Code | 8542.32.00.28 |
Interleaved Burst Length | 24816 |
Sequential Burst Length | 24816 |
Memory Size | 512Mb 16M x 32 |
Organization | 16MX32 |
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