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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| ECCN Code | EAR99 |
| Lead Free | Lead Free |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Packaging | Tray |
| Memory Width | 16 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Factory Lead Time | 14 Weeks |
| Supply Voltage | 1.8V |
| Operating Supply Voltage | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Length | 10mm |
| Terminal Position | BOTTOM |
| Number of Pins | 60 |
| Number of Terminations | 60 |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.1mm |
| Memory Type | Volatile |
| Supply Voltage-Min (Vsup) | 1.7V |
| Data Bus Width | 16b |
| Operating Mode | SYNCHRONOUS |
| Memory Format | DRAM |
| Clock Frequency | 166MHz |
| Write Cycle Time – Word, Page | 15ns |
| Supply Voltage-Max (Vsup) | 1.95V |
| Additional Feature | AUTO/SELF REFRESH |
| Voltage – Supply | 1.7V~1.95V |
| Access Time | 5.5ns |
| Package / Case | 60-TFBGA |
| Memory Size | 128Mb 8M x 16 |
| Organization | 8MX16 |
| Technology | SDRAM – Mobile LPDDR |
| Density | 1 Gb |
| Address Bus Width | 12b |
*The following components have specifications similar
*The following five components have specifications similar
