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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
ECCN Code | EAR99 |
Surface Mount | YES |
Memory Width | 8 |
Factory Lead Time | 8 Weeks |
Packaging | Tray |
Qualification Status | Not Qualified |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 10 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Supply Voltage | 1.8V |
Power Supplies | 1.8V |
Operating Temperature | -40°C~85°C TA |
Interleaved Burst Length | 48 |
Sequential Burst Length | 48 |
Terminal Position | BOTTOM |
Number of Terminations | 60 |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
Height Seated (Max) | 1.2mm |
JESD-609 Code | e1 |
Output Characteristics | 3-STATE |
Width | 8mm |
Memory Type | Volatile |
Supply Voltage-Min (Vsup) | 1.7V |
Operating Mode | SYNCHRONOUS |
I/O Type | COMMON |
Supply Voltage-Max (Vsup) | 1.9V |
Memory Format | DRAM |
Clock Frequency | 400MHz |
Write Cycle Time – Word, Page | 15ns |
Length | 10.5mm |
Voltage – Supply | 1.7V~1.9V |
Refresh Cycles | 8192 |
Terminal Finish | TIN SILVER COPPER |
Additional Feature | AUTO/SELF REFRESH |
Supply Current-Max | 0.3mA |
Memory Density | 1073741824 bit |
Technology | SDRAM – DDR2 |
Memory Size | 1Gb 128M x 8 |
Package / Case | 60-TFBGA |
Organization | 128MX8 |
Access Time | 400ps |
JESD-30 Code | R-PBGA-B60 |
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