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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Surface Mount | YES |
| Factory Lead Time | 12 Weeks |
| Packaging | Tray |
| Qualification Status | Not Qualified |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 1.8V |
| Power Supplies | 1.8V |
| Memory Width | 32 |
| Operating Temperature | -40°C~85°C TA |
| Interleaved Burst Length | 48 |
| Sequential Burst Length | 48 |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| Output Characteristics | 3-STATE |
| Memory Type | Volatile |
| Number of Terminations | 90 |
| Number of Pins | 90 |
| Supply Voltage-Min (Vsup) | 1.7V |
| Length | 13mm |
| Data Bus Width | 32b |
| Operating Mode | SYNCHRONOUS |
| I/O Type | COMMON |
| Memory Format | DRAM |
| Clock Frequency | 166MHz |
| Refresh Cycles | 4096 |
| Supply Voltage-Max (Vsup) | 1.95V |
| Voltage – Supply | 1.7V~1.95V |
| Memory Density | 268435456 bit |
| Access Time | 5.5ns |
| Package / Case | 90-TFBGA |
| Memory Size | 256Mb 8M x 32 |
| Technology | SDRAM – Mobile |
| Standby Current-Max | 0.0003A |
| Supply Current-Max | 0.14mA |
| Organization | 8MX32 |
| Additional Feature | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH |
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