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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Surface Mount | YES |
| Factory Lead Time | 8 Weeks |
| Supply Voltage | 3.3V |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage-Min (Vsup) | 3V |
| Memory Width | 32 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| Operating Temperature | 0°C~70°C TA |
| Width | 8mm |
| Memory Type | Volatile |
| Voltage – Supply | 3V~3.6V |
| Number of Terminations | 90 |
| JESD-609 Code | e2 |
| Length | 13mm |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 133MHz |
| Memory Format | DRAM |
| Access Time | 6ns |
| Additional Feature | AUTO/SELF REFRESH |
| Technology | SDRAM |
| Memory Density | 268435456 bit |
| Package / Case | 90-TFBGA |
| HTS Code | 8542.32.00.24 |
| Memory Size | 256Mb 8M x 32 |
| JESD-30 Code | R-PBGA-B90 |
| Organization | 8MX32 |
| Terminal Finish | Tin/Nickel/Copper (Sn/Ni/Cu) |
*The following components have specifications similar
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