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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 2.5V |
| Operating Supply Voltage | 2.5V |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Memory Width | 32 |
| Operating Temperature | -40°C~85°C TA |
| Part Status | Discontinued |
| Terminal Position | BOTTOM |
| Supply Voltage-Max (Vsup) | 2.7V |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| JESD-609 Code | e1 |
| Output Characteristics | 3-STATE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Memory Type | Volatile |
| Number of Terminations | 90 |
| Number of Pins | 90 |
| Pin Count | 90 |
| Length | 13mm |
| Max Supply Current | 130mA |
| Supply Voltage-Min (Vsup) | 2.3V |
| Data Bus Width | 32b |
| Nominal Supply Current | 160mA |
| I/O Type | COMMON |
| Clock Frequency | 133MHz |
| Memory Format | DRAM |
| Refresh Cycles | 4096 |
| Additional Feature | AUTO/SELF REFRESH |
| Access Time | 5.4ns |
| Interleaved Burst Length | 1248 |
| Sequential Burst Length | 1248FP |
| Standby Current-Max | 0.001A |
| Density | 256 Mb |
| Address Bus Width | 14b |
| Package / Case | 90-TFBGA |
| HTS Code | 8542.32.00.24 |
| Memory Size | 256Mb 8M x 32 |
| Technology | SDRAM – Mobile |
| Organization | 8MX32 |
| Voltage – Supply | 2.3V~3V |
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