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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| ECCN Code | EAR99 |
| Surface Mount | YES |
| Factory Lead Time | 12 Weeks |
| Packaging | Tray |
| Memory Width | 16 |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 2.5V |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage-Max (Vsup) | 3V |
| Operating Temperature | -40°C~85°C TA |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| JESD-609 Code | e1 |
| Length | 8mm |
| Width | 8mm |
| Memory Type | Volatile |
| Number of Terminations | 54 |
| Supply Voltage-Min (Vsup) | 2.3V |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 133MHz |
| Memory Format | DRAM |
| Access Time | 6ns |
| Terminal Finish | TIN SILVER COPPER |
| Additional Feature | AUTO/SELF REFRESH |
| Voltage – Supply | 2.3V~2.7V |
| Memory Density | 33554432 bit |
| HTS Code | 8542.32.00.02 |
| Organization | 2MX16 |
| Package / Case | 54-TFBGA |
| Technology | SDRAM – Mobile |
| Memory Size | 32Mb 2M x 16 |
| JESD-30 Code | S-PBGA-B54 |
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