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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Memory Width | 8 |
| Supply Voltage | 3.3V |
| Programming Voltage | 3.3V |
| Packaging | Tray |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Factory Lead Time | 2 Weeks |
| Height Seated (Max) | 1mm |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Supply Voltage-Min (Vsup) | 2.7V |
| JESD-609 Code | e1 |
| Memory Type | Non-Volatile |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Clock Frequency | 200MHz |
| Voltage – Supply | 2.7V~3.6V |
| Series | Automotive, AEC-Q100 |
| Length | 13mm |
| Operating Mode | SYNCHRONOUS |
| Parallel/Serial | PARALLEL |
| Width | 11.5mm |
| Technology | FLASH – NAND (MLC) |
| Number of Terminations | 153 |
| Memory Size | 64Gb 8G x 8 |
| Memory Interface | eMMC |
| Package / Case | 153-VFBGA |
| Organization | 8GX8 |
| Memory Density | 68719476736 bit |
| JESD-30 Code | R-PBGA-B153 |
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