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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Surface Mount | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Memory Width | 8 |
Supply Voltage | 3.3V |
Programming Voltage | 3.3V |
Packaging | Tray |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Operating Temperature | -40°C~85°C TA |
Terminal Pitch | 0.5mm |
Factory Lead Time | 2 Weeks |
Height Seated (Max) | 1mm |
Memory Format | FLASH |
Supply Voltage-Max (Vsup) | 3.6V |
Terminal Position | BOTTOM |
Supply Voltage-Min (Vsup) | 2.7V |
JESD-609 Code | e1 |
Memory Type | Non-Volatile |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Clock Frequency | 200MHz |
Voltage – Supply | 2.7V~3.6V |
Length | 13mm |
Operating Mode | SYNCHRONOUS |
Parallel/Serial | PARALLEL |
Width | 11.5mm |
Technology | FLASH – NAND (MLC) |
Number of Terminations | 153 |
Memory Size | 256Gb 32G x 8 |
Memory Interface | eMMC |
Package / Case | 153-VFBGA |
JESD-30 Code | R-PBGA-B153 |
Organization | 32GX8 |
Memory Density | 274877906944 bit |
*The following components have specifications similar
*The following five components have specifications similar