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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Mount | Surface Mount |
| RoHS Status | RoHS Compliant |
| ECCN Code | EAR99 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Temperature Grade | COMMERCIAL |
| Pbfree Code | no |
| Qualification Status | Not Qualified |
| JESD-609 Code | e0 |
| Technology | CMOS |
| Operating Temperature (Max) | 70°C |
| Memory Width | 40 |
| Supply Voltage | 1.8V |
| Power Supplies | 1.8V |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Published | 2009 |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Clock Frequency | 166MHz |
| Operating Mode | ASYNCHRONOUS |
| Package / Case | BGA |
| Subcategory | FIFOs |
| HTS Code | 8542.32.00.71 |
| Memory IC Type | OTHER FIFO |
| Supply Current-Max | 0.2mA |
| Access Time (Max) | 3.6 ns |
| Standby Current-Max | 0.12A |
| Number of Terminations | 376 |
| Memory Density | 10485760 bit |
| Organization | 256KX40 |
*The following components have specifications similar
*The following five components have specifications similar
