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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Supply Voltage | 3.3V |
| Power Supplies | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Temperature Grade | COMMERCIAL |
| Qualification Status | Not Qualified |
| JESD-609 Code | e0 |
| Terminal Form | GULL WING |
| Technology | CMOS |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Max Operating Temperature | 70°C |
| Reach Compliance Code | not_compliant |
| Height Seated (Max) | 1.6mm |
| Published | 2009 |
| Terminal Position | QUAD |
| Number of Terminations | 100 |
| Pin Count | 100 |
| Terminal Pitch | 0.65mm |
| Memory Width | 36 |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Peak Reflow Temperature (Cel) | 240 |
| Width | 14mm |
| Output Characteristics | 3-STATE |
| Length | 20mm |
| Terminal Finish | Tin/Lead (Sn85Pb15) |
| Operating Mode | SYNCHRONOUS |
| I/O Type | COMMON |
| Supply Voltage-Max (Vsup) | 3.465V |
| Supply Voltage-Min (Vsup) | 3.135V |
| Frequency | 166MHz |
| Subcategory | SRAMs |
| Standby Current-Max | 0.03A |
| Package / Case | LQFP |
| HTS Code | 8542.32.00.41 |
| Additional Feature | PIPELINED ARCHITECTURE |
| ECCN Code | 3A991.B.2.A |
| Memory Type | RAM, SRAM |
| Access Time (Max) | 3.5 ns |
| Standby Voltage-Min | 3.14V |
| JESD-30 Code | R-PQFP-G100 |
| Memory Density | 4718592 bit |
| Organization | 128KX36 |
| Supply Current-Max | 0.32mA |
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