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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Surface Mount | YES |
| Moisture Sensitivity Level (MSL) | 3 |
| Qualification Status | Not Qualified |
| Min Operating Temperature | -40°C |
| JESD-609 Code | e0 |
| Technology | CMOS |
| Max Operating Temperature | 85°C |
| Supply Voltage | 2.5V |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Terminal Pitch | 1.27mm |
| Published | 2005 |
| Memory Width | 18 |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Terminal Form | BALL |
| Terminal Finish | TIN LEAD |
| Width | 14mm |
| Peak Reflow Temperature (Cel) | 225 |
| Length | 22mm |
| Operating Mode | SYNCHRONOUS |
| Supply Voltage-Min (Vsup) | 2.375V |
| Supply Voltage-Max (Vsup) | 2.625V |
| Package / Case | BGA |
| HTS Code | 8542.32.00.41 |
| Height Seated (Max) | 2.36mm |
| ECCN Code | 3A991.B.2.A |
| Pin Count | 119 |
| Number of Terminations | 119 |
| Access Time (Max) | 8.5 ns |
| Memory Type | RAM, SRAM |
| Additional Feature | FLOW-THROUGH ARCHITECTURE |
| Memory Density | 18874368 bit |
| Organization | 1MX18 |
*The following components have specifications similar
*The following five components have specifications similar
