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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Number of Functions | 1 |
RoHS Status | Non-RoHS Compliant |
Surface Mount | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Moisture Sensitivity Level (MSL) | 3 |
Qualification Status | Not Qualified |
Min Operating Temperature | -40°C |
JESD-609 Code | e0 |
Technology | CMOS |
Max Operating Temperature | 85°C |
Supply Voltage | 2.5V |
Power Supplies | 2.5V |
Published | 2010 |
Reach Compliance Code | not_compliant |
Terminal Pitch | 1.27mm |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Memory Width | 36 |
Interface | Parallel |
Terminal Form | BALL |
Width | 14mm |
Output Characteristics | 3-STATE |
Frequency | 200MHz |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Length | 22mm |
Operating Mode | SYNCHRONOUS |
I/O Type | COMMON |
Supply Voltage-Min (Vsup) | 2.375V |
Supply Voltage-Max (Vsup) | 2.625V |
Subcategory | SRAMs |
Package / Case | BGA |
HTS Code | 8542.32.00.41 |
Additional Feature | PIPELINED ARCHITECTURE |
Height Seated (Max) | 2.36mm |
ECCN Code | 3A991.B.2.A |
Pin Count | 119 |
Number of Terminations | 119 |
Memory Type | RAM, SRAM |
Standby Voltage-Min | 2.38V |
Access Time (Max) | 3.2 ns |
Memory Density | 18874368 bit |
Organization | 512KX36 |
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