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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Number of Functions | 1 |
RoHS Status | Non-RoHS Compliant |
Surface Mount | YES |
Temperature Grade | COMMERCIAL |
Qualification Status | Not Qualified |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Max Operating Temperature | 70°C |
Time@Peak Reflow Temperature-Max (s) | 40 |
Supply Voltage | 1.8V |
Published | 2006 |
Terminal Pitch | 1mm |
Memory Width | 18 |
Terminal Position | BOTTOM |
Interface | Parallel |
Min Operating Temperature | 0°C |
Terminal Form | BALL |
JESD-609 Code | e1 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Length | 25mm |
Width | 25mm |
Supply Voltage-Min (Vsup) | 1.7V |
Operating Mode | SYNCHRONOUS |
Supply Voltage-Max (Vsup) | 1.9V |
HTS Code | 8542.32.00.41 |
ECCN Code | 3A991.B.2.A |
Package / Case | FCBGA |
Number of Terminations | 576 |
Pin Count | 576 |
Height Seated (Max) | 2.55mm |
Access Time (Max) | 0.45 ns |
Memory Density | 9437184 bit |
Frequency | 233MHz |
Organization | 512KX18 |
Memory Type | QDR, RAM, SRAM |
JESD-30 Code | S-PBGA-B576 |
*The following components have specifications similar
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