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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| ECCN Code | EAR99 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Terminations | 8 |
| Memory Width | 8 |
| Terminal Position | DUAL |
| Packaging | Tube |
| Supply Voltage | 3.3V |
| Factory Lead Time | 10 Weeks |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Published | 2008 |
| Terminal Pitch | 1.27mm |
| Width | 5mm |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2V |
| Height Seated (Max) | 0.8mm |
| Length | 6mm |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Clock Frequency | 40MHz |
| Operating Temperature | -40°C~105°C TA |
| Interface | SPI, Serial |
| Operating Mode | SYNCHRONOUS |
| Voltage – Supply | 2V~3.6V |
| Package / Case | 8-WDFN Exposed Pad |
| HTS Code | 8542.32.00.71 |
| JESD-30 Code | R-PDSO-N8 |
| Memory Format | FRAM |
| Memory Size | 2Mb 256K x 8 |
| Memory Density | 2097152 bit |
| Technology | FRAM (Ferroelectric RAM) |
| Organization | 256KX8 |
| Series | F-RAM? |
*The following components have specifications similar
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