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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mount | Surface Mount |
Number of Functions | 1 |
Memory Width | 1 |
RoHS Status | RoHS Compliant |
ECCN Code | EAR99 |
Lead Free | Lead Free |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Min Operating Temperature | -40°C |
Technology | CMOS |
Factory Lead Time | 16 Weeks |
Max Operating Temperature | 85°C |
Published | 2015 |
Supply Voltage | 1.8V |
Number of Terminations | 24 |
Number of Pins | 24 |
Temperature Grade | INDUSTRIAL |
Max Supply Voltage | 2V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
JESD-609 Code | e1 |
Min Supply Voltage | 1.7V |
Parallel/Serial | SERIAL |
Operating Mode | SYNCHRONOUS |
HTS Code | 8542.32.00.51 |
Terminal Finish | TIN SILVER COPPER |
Package / Case | FBGA |
Write Cycle Time-Max (tWC) | 8ms |
Memory Density | 536870912 bit |
Memory Size | 512MB |
Memory IC Type | CONFIGURATION MEMORY |
Organization | 512MX1 |
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