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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Functions | 1 |
| Moisture Sensitivity Level (MSL) | 1 |
| Memory Width | 1 |
| ECCN Code | EAR99 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Supply Voltage | 5V |
| Power Supplies | 5V |
| Pbfree Code | no |
| Lead Free | Contains Lead |
| Qualification Status | Not Qualified |
| Min Operating Temperature | -40°C |
| JESD-609 Code | e0 |
| Max Operating Temperature | 85°C |
| Number of Pins | 20 |
| Number of Terminations | 20 |
| Pin Count | 20 |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage-Max (Vsup) | 5.5V |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Pitch | 1.27mm |
| Published | 2005 |
| Terminal Position | QUAD |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Min (Vsup) | 4.5V |
| Terminal Form | J BEND |
| Output Characteristics | 3-STATE |
| Parallel/Serial | SERIAL |
| Operating Mode | SYNCHRONOUS |
| I/O Type | COMMON |
| Peak Reflow Temperature (Cel) | 220 |
| Frequency | 6MHz |
| Height Seated (Max) | 4.572mm |
| Package / Case | PLCC |
| Technology | MOS |
| Memory Density | 65536 bit |
| Length | 8.9662mm |
| Width | 8.9662mm |
| HTS Code | 8542.32.00.61 |
| Memory IC Type | CONFIGURATION MEMORY |
| Subcategory | OTP ROMs |
| Organization | 64KX1 |
| Memory Size | 8.1kB |
| Additional Feature | 4 WIRE INTERFACE TO FLEX 8000 DEVICES |
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