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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| JESD-609 Code | e3 |
| Part Status | Obsolete |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Memory Width | 8 |
| Packaging | Tube |
| Supply Voltage | 3.3V |
| Qualification Status | Not Qualified |
| Number of Macro Cells | 16 |
| Technology | CMOS |
| Terminal Finish | Matte Tin (Sn) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage-Min (Vsup) | 3V |
| Terminal Pitch | 1.27mm |
| Operating Temperature | -40°C~85°C TA |
| Terminal Position | QUAD |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Memory Interface | Parallel |
| Height Seated (Max) | 4.57mm |
| Memory Type | Non-Volatile |
| Number of Terminations | 52 |
| Number of Pins | 52 |
| Pin Count | 52 |
| Voltage – Supply | 3V~3.6V |
| Peak Reflow Temperature (Cel) | 245 |
| Operating Mode | ASYNCHRONOUS |
| HTS Code | 8542.32.00.71 |
| Number of Gates | 3000 |
| Access Time | 150ns |
| Memory Size | 2Mb 256K x 8 |
| Package / Case | 52-LCC (J-Lead) |
| Organization | 256KX8 |
| Length | 19.1262mm |
| Width | 19.1262mm |
| Frequency | 150GHz |
| Base Part Number | DSM2190 |
*The following components have specifications similar
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