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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Mounting Type | Surface Mount |
Number of Functions | 1 |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |
Surface Mount | YES |
Lead Free | Lead Free |
Part Status | Obsolete |
Memory Width | 8 |
Terminal Position | DUAL |
Supply Voltage | 5V |
Operating Supply Voltage | 5V |
Power Supplies | 5V |
Packaging | Tube |
JESD-609 Code | e0 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Published | 2010 |
Operating Temperature | -40°C~85°C TA |
Memory Interface | Parallel |
Number of Pins | 34 |
Number of Terminations | 34 |
Pin Count | 34 |
Terminal Finish | TIN LEAD |
Memory Type | Non-Volatile |
Data Bus Width | 8b |
Peak Reflow Temperature (Cel) | 225 |
Voltage – Supply | 4.75V~5.25V |
Subcategory | SRAMs |
Access Time (Max) | 70 ns |
Write Cycle Time – Word, Page | 70ns |
HTS Code | 8542.32.00.41 |
ECCN Code | 3A991.B.2.A |
Memory Format | NVSRAM |
Technology | NVSRAM (Non-Volatile SRAM) |
Density | 4 Mb |
Memory Size | 4Mb 512K x 8 |
Organization | 512KX8 |
Frequency | 70GHz |
Standby Current-Max | 0.00015A |
Package / Case | 34-PowerCap? Module |
Supply Current-Max | 0.085mA |
Base Part Number | DS1350AB |
*The following components have specifications similar
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