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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Surface Mount | NO |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Through Hole |
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Part Status | Obsolete |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Memory Width | 8 |
| Terminal Position | DUAL |
| Packaging | Tube |
| Supply Voltage | 3.3V |
| Pbfree Code | no |
| Lead Free | Contains Lead |
| Qualification Status | Not Qualified |
| JESD-609 Code | e0 |
| Supply Voltage-Min (Vsup) | 3V |
| Published | 2010 |
| Operating Temperature | -40°C~85°C TA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Number of Terminations | 36 |
| Pin Count | 36 |
| Memory Interface | Parallel |
| Terminal Finish | TIN LEAD |
| Memory Type | Non-Volatile |
| Voltage – Supply | 3V~3.6V |
| Operating Mode | ASYNCHRONOUS |
| Access Time (Max) | 100 ns |
| ECCN Code | 3A991.B.2.A |
| Write Cycle Time – Word, Page | 100ns |
| Memory Format | NVSRAM |
| Technology | NVSRAM (Non-Volatile SRAM) |
| Memory Density | 16777216 bit |
| Memory Size | 16Mb 2M x 8 |
| HTS Code | 8473.30.11.40 |
| Organization | 2MX8 |
| Package / Case | 36-DIP Module (0.600, 15.24mm) |
| JESD-30 Code | R-XDMA-P36 |
| Base Part Number | DS1270W |
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