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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| DAC Channels | NO |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Surface Mount | YES |
| Has ADC | YES |
| PWM Channels | YES |
| DMA Channels | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| On Chip Program ROM Width | 8 |
| Packaging | Tray |
| External Data Bus Width | 16 |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage-Max (Vsup) | 5.5V |
| Bit Size | 32 |
| Operating Temperature | -40°C~85°C TA |
| Program Memory Type | FLASH |
| Length | 10mm |
| Width | 10mm |
| Terminal Position | BOTTOM |
| Oscillator Type | Internal |
| Address Bus Width | 25 |
| Factory Lead Time | 19 Weeks |
| Supply Voltage-Min (Vsup) | 2.7V |
| Terminal Pitch | 0.8mm |
| Terminal Form | BALL |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Voltage – Supply (Vcc/Vdd) | 2.7V~5.5V |
| Height Seated (Max) | 1.45mm |
| Core Size | 32-Bit |
| Clock Frequency | 48MHz |
| Peripherals | DMA, LVD, POR, PWM, WDT |
| Core Processor | ARM? Cortex?-M3 |
| Number of Terminations | 112 |
| Number of I/O | 83 |
| Data Converter | A/D 16x12b |
| RAM Size | 48K x 8 |
| Speed | 144MHz |
| Package / Case | 112-LFBGA |
| Program Memory Size | 416KB 416K x 8 |
| JESD-30 Code | S-PBGA-B112 |
| Connectivity | CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART |
| Series | FM3 MB9B410R |
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