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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
DAC Channels | NO |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Surface Mount | YES |
Has ADC | YES |
PWM Channels | YES |
DMA Channels | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
On Chip Program ROM Width | 8 |
Packaging | Tray |
External Data Bus Width | 16 |
Technology | CMOS |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Bit Size | 32 |
Operating Temperature | -40°C~85°C TA |
Factory Lead Time | 18 Weeks |
Program Memory Type | FLASH |
Length | 10mm |
Width | 10mm |
Supply Voltage-Max (Vsup) | 3.6V |
Terminal Position | BOTTOM |
Oscillator Type | Internal |
Address Bus Width | 25 |
Terminal Pitch | 0.8mm |
Terminal Form | BALL |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Height Seated (Max) | 1.45mm |
Core Size | 32-Bit |
Speed | 40MHz |
Clock Frequency | 48MHz |
RAM Size | 32K x 8 |
Supply Voltage-Min (Vsup) | 1.65V |
Core Processor | ARM? Cortex?-M3 |
Peripherals | LVD, POR, PWM, WDT |
Voltage – Supply (Vcc/Vdd) | 1.65V~3.6V |
Number of Terminations | 112 |
Number of I/O | 83 |
Data Converter | A/D 24x12b |
Package / Case | 96-LFBGA |
Program Memory Size | 288KB 288K x 8 |
JESD-30 Code | S-PBGA-B112 |
Connectivity | CSIO, EBI/EMI, I2C, SPI, UART/USART |
Series | FM3 MB9A140NB |
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