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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
DMA Channels | NO |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Surface Mount | YES |
Has ADC | YES |
PWM Channels | YES |
DAC Channels | YES |
JESD-609 Code | e3 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
On Chip Program ROM Width | 8 |
Supply Voltage | 3.3V |
Packaging | Tray |
Technology | CMOS |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Supply Voltage-Max (Vsup) | 5.5V |
Terminal Finish | Tin (Sn) |
Bit Size | 32 |
Terminal Pitch | 0.5mm |
Terminal Position | QUAD |
Program Memory Type | FLASH |
Terminal Form | NO LEAD |
Oscillator Type | Internal |
Number of Terminations | 64 |
Supply Voltage-Min (Vsup) | 2.7V |
Height Seated (Max) | 0.8mm |
Factory Lead Time | 22 Weeks |
Length | 9mm |
Width | 9mm |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Voltage – Supply (Vcc/Vdd) | 2.7V~5.5V |
Core Size | 32-Bit |
Speed | 40MHz |
Operating Temperature | -40°C~105°C TA |
Clock Frequency | 48MHz |
Peripherals | DMA, LVD, POR, PWM, WDT |
RAM Size | 4K x 8 |
Number of I/O | 51 |
Core Processor | ARM? Cortex?-M3 |
Program Memory Size | 64KB 64K x 8 |
RAM (bytes) | 4096 |
JESD-30 Code | S-XQCC-N64 |
ROM (words) | 65536 |
Package / Case | 64-WFQFN Exposed Pad |
Data Converter | A/D 8x12b; D/A 1x10b |
Connectivity | CSIO, I2C, LINbus, SPI, UART/USART |
Series | FM3 MB9A120L |
Additional Feature | WHEN MOUNTED ON DOUBLE-SIDED SINGLE-LAYER PCB TEMP WILL BE -40 TO 85 |
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