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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
DMA Channels | NO |
DAC Channels | NO |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Surface Mount | YES |
Has ADC | YES |
PWM Channels | YES |
JESD-609 Code | e3 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Bit Size | 8 |
On Chip Program ROM Width | 8 |
Packaging | Tray |
Terminal Form | GULL WING |
Technology | CMOS |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Supply Voltage | 3V |
Supply Voltage-Max (Vsup) | 5.5V |
Supply Voltage-Min (Vsup) | 1.8V |
Terminal Finish | Tin (Sn) |
Operating Temperature | -40°C~85°C TA |
Factory Lead Time | 15 Weeks |
Terminal Pitch | 0.5mm |
Terminal Position | QUAD |
Program Memory Type | FLASH |
Length | 10mm |
Width | 10mm |
Number of Terminations | 64 |
Oscillator Type | External |
Core Size | 8-Bit |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Speed | 16MHz |
Height Seated (Max) | 1.7mm |
Voltage – Supply (Vcc/Vdd) | 1.8V~5.5V |
Package / Case | 64-LQFP |
RAM Size | 512 x 8 |
RAM (bytes) | 512 |
Number of I/O | 59 |
JESD-30 Code | S-PQFP-G64 |
Peripherals | LCD, LVD, POR, PWM, WDT |
Core Processor | F2MC-8FX |
ROM (words) | 20480 |
Connectivity | I2C, SIO, UART/USART |
Program Memory Size | 20KB 20K x 8 |
Clock Frequency | 32.5MHz |
Data Converter | A/D 8×8/12b |
Series | F2MC-8FX MB95770L |
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