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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Number of Ports | 2 |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Radiation Hardening | No |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Factory Lead Time | 13 Weeks |
| Supply Voltage | 1.8V |
| Operating Supply Voltage | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 1mm |
| Memory Width | 18 |
| Terminal Position | BOTTOM |
| Memory Interface | Parallel |
| Published | 2003 |
| JESD-609 Code | e1 |
| Height Seated (Max) | 1.4mm |
| Output Characteristics | 3-STATE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Supply Voltage-Min (Vsup) | 1.7V |
| Standby Voltage-Min | 1.7V |
| Sync/Async | Synchronous |
| Length | 17mm |
| Supply Voltage-Max (Vsup) | 1.9V |
| Clock Frequency | 300MHz |
| Number of Pins | 165 |
| Number of Terminations | 165 |
| Pin Count | 165 |
| Voltage – Supply | 1.7V~1.9V |
| Word Size | 18b |
| Additional Feature | PIPELINED ARCHITECTURE |
| Package / Case | 165-LBGA |
| Access Time | 450 ps |
| I/O Type | SEPARATE |
| Technology | SRAM – Synchronous, QDR II |
| Address Bus Width | 22b |
| Nominal Supply Current | 910mA |
| Density | 144 Mb |
| Standby Current-Max | 0.39A |
| Memory Size | 144Mb 8M x 18 |
| Organization | 8MX18 |
| Base Part Number | CY7C1612 |
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