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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Part Status | Obsolete |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Packaging | Tray |
| Qualification Status | COMMERCIAL |
| Pbfree Code | no |
| JESD-609 Code | e0 |
| Reach Compliance Code | unknown |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Memory Width | 36 |
| Memory Interface | Parallel |
| Terminal Finish | TIN LEAD |
| Height Seated (Max) | 1.4mm |
| Operating Temperature | 0°C~70°C TA |
| Width | 15mm |
| Memory Type | Volatile |
| Clock Frequency | 200MHz |
| Memory Format | SRAM |
| Supply Voltage-Min (Vsup) | 1.7V |
| Length | 17mm |
| Supply Voltage-Max (Vsup) | 1.9V |
| Number of Terminations | 165 |
| Pin Count | 165 |
| Peak Reflow Temperature (Cel) | 220 |
| Voltage – Supply | 1.7V~1.9V |
| Additional Feature | PIPELINED ARCHITECTURE |
| Package / Case | 165-LBGA |
| Technology | SRAM – Synchronous, QDR II |
| Memory Size | 72Mb 2M x 36 |
| Access Time (Max) | 0.45 ns |
| Organization | 2MX36 |
| JESD-30 Code | R-PBGA-B165 |
| Memory Density | 75497472 bit |
*The following components have specifications similar
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