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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Part Status | Obsolete |
| Packaging | Tray |
| Lead Free | Contains Lead |
| Qualification Status | Not Qualified |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Reach Compliance Code | unknown |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 1.8V |
| Operating Supply Voltage | 1.8V |
| Memory Width | 18 |
| Terminal Position | BOTTOM |
| Memory Interface | Parallel |
| Published | 2003 |
| JESD-609 Code | e1 |
| Operating Temperature | 0°C~70°C TA |
| Output Characteristics | 3-STATE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Memory Type | Volatile |
| Clock Frequency | 200MHz |
| Nominal Supply Current | 600mA |
| Memory Format | SRAM |
| Sync/Async | Synchronous |
| I/O Type | COMMON |
| Access Time | 50 ns |
| Number of Pins | 165 |
| Number of Terminations | 165 |
| Pin Count | 165 |
| Voltage – Supply | 1.7V~1.9V |
| Word Size | 18b |
| Additional Feature | PIPELINED ARCHITECTURE |
| Package / Case | 165-LBGA |
| Address Bus Width | 20b |
| Density | 18 Mb |
| Memory Size | 18Mb 1M x 18 |
| Technology | SRAM – Synchronous, DDR II |
| Standby Current-Max | 0.29A |
| Base Part Number | CY7C1318 |
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