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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Part Status | Obsolete |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Memory Width | 8 |
| Supply Voltage | 3.3V |
| Packaging | Tray |
| Qualification Status | COMMERCIAL |
| Pbfree Code | no |
| JESD-609 Code | e0 |
| Reach Compliance Code | unknown |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Number of Terminations | 60 |
| Pin Count | 60 |
| Memory Interface | Parallel |
| Height Seated (Max) | 1.2mm |
| Terminal Finish | TIN LEAD |
| Operating Temperature | 0°C~70°C TA |
| Width | 8mm |
| Length | 20mm |
| Memory Type | Volatile |
| Voltage – Supply | 3V~3.6V |
| Memory Format | SRAM |
| Write Cycle Time – Word, Page | 10ns |
| Access Time (Max) | 10 ns |
| Technology | SRAM – Asynchronous |
| Terminal Pitch | 0.75mm |
| Memory Density | 16777216 bit |
| Memory Size | 16Mb 2M x 8 |
| Package / Case | 60-TFBGA |
| Organization | 2MX8 |
| JESD-30 Code | R-PBGA-B60 |
*The following components have specifications similar
*The following five components have specifications similar
