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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Surface Mount | YES |
| Part Status | Obsolete |
| Supply Voltage | 3.3V |
| Packaging | Tray |
| Qualification Status | COMMERCIAL |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Reach Compliance Code | unknown |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Height Seated (Max) | 1.6mm |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 1mm |
| Memory Width | 18 |
| Terminal Position | BOTTOM |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Voltage – Supply | 3.135V~3.465V |
| Length | 13mm |
| Width | 13mm |
| Number of Terminations | 144 |
| Pin Count | 144 |
| Supply Voltage-Max (Vsup) | 3.465V |
| Supply Voltage-Min (Vsup) | 3.135V |
| Clock Frequency | 133MHz |
| Terminal Finish | TIN SILVER COPPER |
| Access Time (Max) | 4 ns |
| Additional Feature | PIPELINED ARCHITECTURE |
| Technology | SRAM – Dual Port, Synchronous |
| JESD-30 Code | S-PBGA-B144 |
| Package / Case | 144-LFBGA |
| Memory Density | 2359296 bit |
| Memory Size | 2Mb 128K x 18 |
| Organization | 128KX18 |
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