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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Number of Functions | 1 |
Surface Mount | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Memory Width | 8 |
Packaging | Tray |
Operating Temperature (Min) | -40°C |
Technology | CMOS |
Operating Temperature (Max) | 85°C |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Supply Voltage | 3V |
Factory Lead Time | 13 Weeks |
Height Seated (Max) | 1mm |
Temperature Grade | INDUSTRIAL |
Number of Terminations | 48 |
Supply Voltage-Max (Vsup) | 3.6V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Width | 6mm |
Length | 8mm |
Supply Voltage-Min (Vsup) | 2.2V |
Parallel/Serial | PARALLEL |
Operating Mode | ASYNCHRONOUS |
Access Time (Max) | 45 ns |
Terminal Pitch | 0.75mm |
Memory IC Type | STANDARD SRAM |
Memory Density | 16777216 bit |
JESD-30 Code | R-PBGA-B48 |
Organization | 2MX8 |
*The following components have specifications similar
*The following five components have specifications similar