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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Packaging | Tray |
| Qualification Status | Not Qualified |
| Memory Width | 16 |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 3V |
| Operating Supply Voltage | 3V |
| Factory Lead Time | 7 Weeks |
| Published | 2005 |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 1mm |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Supply Voltage-Min (Vsup) | 2.7V |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Height Seated (Max) | 1.4mm |
| Memory Type | Non-Volatile |
| Voltage – Supply | 2.7V~3.6V |
| Contact Plating | Copper, Silver, Tin |
| Data Bus Width | 16b |
| Length | 17mm |
| Number of Pins | 165 |
| Number of Terminations | 165 |
| Operating Mode | ASYNCHRONOUS |
| Subcategory | SRAMs |
| Terminal Finish | TIN SILVER COPPER |
| HTS Code | 8542.32.00.41 |
| Access Time (Max) | 45 ns |
| ECCN Code | 3A991.B.2.A |
| Package / Case | 165-LBGA |
| Write Cycle Time – Word, Page | 45ns |
| Memory Format | NVSRAM |
| Technology | NVSRAM (Non-Volatile SRAM) |
| Organization | 1MX16 |
| Density | 16 Mb |
| Memory Size | 16Mb 1M x 16 |
| Supply Current-Max | 0.095mA |
| Standby Current-Max | 0.00075A |
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