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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Radiation Hardening | No |
| JESD-609 Code | e3 |
| Lead Free | Lead Free |
| Contact Plating | Tin |
| Terminal Position | DUAL |
| Factory Lead Time | 12 Weeks |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Max Power Dissipation | 1W |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 3V |
| Operating Supply Voltage | 3V |
| Published | 2007 |
| Operating Temperature | -40°C~85°C TA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Memory Type | Non-Volatile |
| Frequency | 1MHz |
| Voltage – Supply | 2.7V~3.6V |
| Number of Terminations | 54 |
| Number of Pins | 54 |
| Pin Count | 54 |
| Data Bus Width | 16b |
| Word Size | 16b |
| Logic Function | Clock |
| Subcategory | SRAMs |
| Height | 1.05mm |
| Access Time (Max) | 45 ns |
| ECCN Code | 3A991.B.2.A |
| Standby Current-Max | 0.01A |
| Write Cycle Time – Word, Page | 45ns |
| Memory Format | NVSRAM |
| Technology | NVSRAM (Non-Volatile SRAM) |
| Address Bus Width | 19b |
| Nominal Supply Current | 57mA |
| Package / Case | 54-TSOP (0.400, 10.16mm Width) |
| Density | 8 Mb |
| Organization | 512KX16 |
| Time Format | HH:MM:SS |
| Memory Size | 8Mb 512K x 16 |
| Base Part Number | CY14B108 |
| Width | 10.262mm |
| Length | 22.52mm |
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