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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Surface Mount | YES |
| Lead Free | Lead Free |
| Memory Width | 8 |
| Supply Voltage | 5V |
| Factory Lead Time | 12 Weeks |
| Number of Terminations | 4 |
| Published | 2016 |
| Technology | CMOS |
| Supply Voltage-Min (Vsup) | 2.5V |
| Supply Voltage-Max (Vsup) | 5.5V |
| Operating Temperature | -40°C~85°C TA |
| Terminal Position | BOTTOM |
| JESD-609 Code | e1 |
| Memory Type | Non-Volatile |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Memory Interface | I2C |
| Serial Bus Type | I2C |
| Clock Frequency | 1MHz |
| Memory Format | EEPROM |
| Parallel/Serial | SERIAL |
| Terminal Pitch | 0.4mm |
| Write Cycle Time – Word, Page | 5ms |
| Write Cycle Time-Max (tWC) | 5ms |
| Operating Mode | SYNCHRONOUS |
| Height Seated (Max) | 0.3mm |
| Voltage – Supply | 1.7V~5.5V |
| Width | 0.85mm |
| Length | 0.85mm |
| Access Time | 400ns |
| JESD-30 Code | S-PBGA-B4 |
| Package / Case | 4-XFBGA, WLCSP |
| Organization | 16KX8 |
| Memory Density | 131072 bit |
| Memory Size | 128K 16K x 8 |
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