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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Terminations | 8 |
| Memory Width | 8 |
| Terminal Position | DUAL |
| Technology | CMOS |
| Width | 2mm |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage | 1.8V |
| Factory Lead Time | 9 Weeks |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Length | 3mm |
| Packaging | Cut Tape (CT) |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Serial Bus Type | SPI |
| Clock Frequency | 20MHz |
| Memory Format | EEPROM |
| Height Seated (Max) | 0.6mm |
| Parallel/Serial | SERIAL |
| Write Cycle Time – Word, Page | 5ms |
| Write Cycle Time-Max (tWC) | 5ms |
| Operating Mode | SYNCHRONOUS |
| Supply Voltage-Min (Vsup) | 1.6V |
| Voltage – Supply | 1.6V~5.5V |
| JESD-30 Code | R-PDSO-N8 |
| Package / Case | 8-UFDFN Exposed Pad |
| Memory Size | 32Kb 4K x 8 |
| Organization | 4KX8 |
| Memory Density | 32768 bit |
*The following components have specifications similar
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