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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Number of Elements2
Mounting TypeSurface Mount
MountSurface Mount
PackagingTape & Reel (TR)
ECCN CodeEAR99
Radiation HardeningNo
JESD-609 Codee3
Lead FreeLead Free
Number of Pins8
Number of Terminations8
Terminal FormGULL WING
REACH SVHCNo SVHC
Terminal FinishMatte Tin (Sn)
Published2011
Element ConfigurationDual
Transistor Element MaterialSILICON
Length5mm
Max Power Dissipation2W
Power Dissipation2W
Gate to Source Voltage (Vgs)20V
Part StatusNot For New Designs
Width4mm
Operating Temperature-55°C~150°C TJ
Threshold Voltage1V
Package / Case8-SOIC (0.154, 3.90mm Width)
Transistor ApplicationSWITCHING
Operating ModeENHANCEMENT MODE
Height1.5mm
Factory Lead Time26 Weeks
Drain to Source Breakdown Voltage55V
SubcategoryOther Transistors
FET TechnologyMETAL-OXIDE SEMICONDUCTOR
SeriesHEXFET?
Continuous Drain Current (ID)3.4A
FET FeatureLogic Level Gate
Vgs(th) (Max) @ Id1V @ 250μA
Drain Current-Max (Abs) (ID)4.7A
FET TypeN and P-Channel
Drain-source On Resistance-Max0.05Ohm
Polarity/Channel TypeN-CHANNEL AND P-CHANNEL
Nominal Vgs1 V
Additional FeatureAVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
Gate Charge (Qg) (Max) @ Vgs36nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds740pF @ 25V
Rds On (Max) @ Id, Vgs50m Ω @ 4.7A, 10V
Current – Continuous Drain (Id) @ 25°C4.7A 3.4A

Manufacturer introduction

*The following five components have specifications similar