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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Memory Width | 1 |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Factory Lead Time | 12 Weeks |
| Operating Temperature | -40°C~85°C |
| Technology | CMOS |
| Terminal Finish | Matte Tin (Sn) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 1.8V |
| Programming Voltage | 1.8V |
| Number of Terminations | 24 |
| Terminal Pitch | 1mm |
| Height Seated (Max) | 1mm |
| Memory Format | FLASH |
| Terminal Position | BOTTOM |
| Width | 6mm |
| Memory Type | Non-Volatile |
| Length | 8mm |
| Parallel/Serial | SERIAL |
| Operating Mode | SYNCHRONOUS |
| Clock Frequency | 133MHz |
| Supply Voltage-Min (Vsup) | 1.65V |
| Supply Voltage-Max (Vsup) | 1.95V |
| Voltage – Supply | 1.65V~1.95V |
| Memory Density | 33554432 bit |
| Memory Size | 32Mb 4M x 8 |
| Package / Case | 24-VBGA |
| Memory Interface | SPI – Quad I/O, QPI, DTR |
| Organization | 32MX1 |
| JESD-30 Code | S-PBGA-B24 |
*The following components have specifications similar
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