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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Surface Mount | NO |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Memory Width | 1 |
| Pbfree Code | yes |
| JESD-609 Code | e3 |
| Contact Plating | Tin |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Pins | 8 |
| Number of Terminations | 8 |
| Temperature Grade | COMMERCIAL |
| Qualification Status | Not Qualified |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Max Operating Temperature | 70°C |
| Supply Voltage | 3V |
| Max Supply Voltage | 5.5V |
| Published | 2007 |
| Min Supply Voltage | 2.7V |
| Min Operating Temperature | 0°C |
| Factory Lead Time | 22 Weeks |
| Nominal Supply Current | 5mA |
| Terminal Form | UNSPECIFIED |
| Terminal Position | UNSPECIFIED |
| Memory Type | EEPROM |
| Operating Mode | ASYNCHRONOUS |
| Frequency | 5MHz |
| Interface | 2-Wire, I2C, Serial |
| Density | 256 kb |
| Write Cycle Time-Max (tWC) | 7ms |
| Access Time | 35 μs |
| Series | CryptoMemory? |
| Organization | 256KX1 |
| Applications | Embedded, Smart Card |
| Type | Secure Memory |
| Package / Case | M2 J, Smart Card Module (TWI) |
| Base Part Number | AT88SC25616 |
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