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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Surface Mount | YES |
JESD-609 Code | e3 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Memory Width | 8 |
Supply Voltage | 5V |
Programming Voltage | 5V |
Packaging | Tube |
Technology | CMOS |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Supply Voltage-Max (Vsup) | 5.5V |
Terminal Pitch | 1.27mm |
Number of Terminations | 32 |
Terminal Position | QUAD |
Supply Voltage-Min (Vsup) | 4.5V |
Memory Interface | Parallel |
Voltage – Supply | 4.5V~5.5V |
Published | 1997 |
Memory Type | Non-Volatile |
Terminal Finish | Matte Tin (Sn) – annealed |
Factory Lead Time | 26 Weeks |
Memory Format | EEPROM |
Width | 11.43mm |
Write Cycle Time – Word, Page | 10ms |
Write Cycle Time-Max (tWC) | 10ms |
Operating Mode | ASYNCHRONOUS |
Length | 13.97mm |
Operating Temperature | -40°C~85°C TC |
Memory Size | 256Kb 32K x 8 |
Height Seated (Max) | 3.556mm |
Access Time | 90ns |
Package / Case | 32-LCC (J-Lead) |
Organization | 32KX8 |
Memory Density | 262144 bit |
JESD-30 Code | R-PQCC-J32 |
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