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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Number of Functions | 1 |
Pbfree Code | yes |
Radiation Hardening | No |
Data Polling | YES |
Toggle Bit | YES |
JESD-609 Code | e3 |
Lead Free | Lead Free |
Contact Plating | Tin |
Memory Width | 8 |
Terminal Position | DUAL |
Operating Supply Voltage | 3.3V |
Packaging | Tray |
Technology | CMOS |
REACH SVHC | No SVHC |
Peak Reflow Temperature (Cel) | 260 |
Data Retention Time-Min | 10 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 40 |
Supply Voltage | 3V |
Programming Voltage | 3V |
Factory Lead Time | 7 Weeks |
Number of Terminations | 28 |
Number of Pins | 28 |
Supply Voltage-Max (Vsup) | 3.6V |
Supply Voltage-Min (Vsup) | 2.7V |
Memory Interface | Parallel |
Height Seated (Max) | 1.2mm |
Published | 1997 |
Memory Type | Non-Volatile |
Width | 8mm |
Nominal Supply Current | 15mA |
Voltage – Supply | 2.7V~3.6V |
Memory Format | EEPROM |
Write Cycle Time – Word, Page | 10ms |
Terminal Pitch | 0.55mm |
Frequency | 5MHz |
Write Cycle Time-Max (tWC) | 10 ms |
Operating Temperature | -40°C~85°C TC |
Endurance | 100000 Write/Erase Cycles |
Access Time | 200ns |
Memory Size | 64Kb 8K x 8 |
Density | 64 kb |
Length | 11.8mm |
Organization | 8KX8 |
Standby Current-Max | 0.00005A |
Package / Case | 28-TSSOP (0.465, 11.80mm Width) |
Interface | Parallel, SPI |
Page Size | 64words |
Base Part Number | AT28BV64 |
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