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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Terminations | 8 |
| Memory Width | 8 |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Published | 2004 |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Serial Bus Type | SPI |
| Factory Lead Time | 26 Weeks |
| Supply Voltage-Min (Vsup) | 1.7V |
| Memory Format | EEPROM |
| Parallel/Serial | SERIAL |
| Write Cycle Time-Max (tWC) | 5ms |
| Operating Mode | SYNCHRONOUS |
| Write Cycle Time – Word, Page | 10ms |
| Clock Frequency | 5MHz |
| Operating Temperature | -40°C~85°C TC |
| Voltage – Supply | 1.7V~5.5V |
| Height Seated (Max) | 0.33mm |
| Memory Size | 2Mb 256K x 8 |
| Memory Density | 2097152 bit |
| Organization | 256KX8 |
| Package / Case | 8-XFBGA, WLCSP |
| JESD-30 Code | X-PBGA-B8 |
*The following components have specifications similar
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