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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Packaging | Tape & Reel (TR) |
Number of Functions | 1 |
Number of Terminations | 8 |
Memory Width | 8 |
Supply Voltage | 5V |
Qualification Status | Not Qualified |
Technology | CMOS |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Supply Voltage-Max (Vsup) | 5.5V |
Published | 2005 |
Operating Temperature | -40°C~85°C TA |
Factory Lead Time | 15 Weeks |
Data Retention Time-Min | 100 |
Terminal Position | BOTTOM |
Supply Voltage-Min (Vsup) | 4.5V |
JESD-609 Code | e1 |
Memory Type | Non-Volatile |
Memory Interface | SPI |
Serial Bus Type | SPI |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Frequency | 20MHz |
Memory Format | EEPROM |
Contact Plating | Copper, Silver, Tin |
Write Cycle Time – Word, Page | 5ms |
Write Cycle Time-Max (tWC) | 5ms |
Interface | SPI, Serial |
Operating Mode | SYNCHRONOUS |
Access Time | 20 ns |
Endurance | 1000000 Write/Erase Cycles |
Supply Current-Max | 0.01mA |
Write Protection | HARDWARE/SOFTWARE |
Voltage – Supply | 1.7V~5.5V |
Memory Size | 1Mb 128K x 8 |
Density | 1 Mb |
Organization | 128KX8 |
Power Supplies | 1.8/5V |
Standby Current-Max | 0.000003A |
Terminal Pitch | 0.43mm |
Package / Case | 8-XFBGA, WLCSP |
Height Seated (Max) | 0.54mm |
Additional Feature | ALSO OPERATES AT 1.7 V AND 2.5 V AT 5 MHZ AND 10 MHZ RESPECTIVELY |
JESD-30 Code | X-PBGA-B8 |
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