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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Number of Functions | 1 |
Memory Width | 1 |
ECCN Code | EAR99 |
Pbfree Code | yes |
Contact Plating | Gold |
Lead Free | Lead Free |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-609 Code | e4 |
Number of Pins | 8 |
Number of Terminations | 8 |
Terminal Position | DUAL |
Factory Lead Time | 8 Weeks |
Published | 2013 |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1.8V |
Terminal Pitch | 1.27mm |
Memory Format | FLASH |
Supply Voltage-Max (Vsup) | 3.6V |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Packaging | Cut Tape (CT) |
Width | 3.9mm |
Height Seated (Max) | 1.75mm |
Memory Type | Non-Volatile |
Memory Interface | SPI |
Interface | SPI, Serial |
Operating Mode | SYNCHRONOUS |
Supply Voltage-Min (Vsup) | 1.65V |
Voltage – Supply | 1.65V~3.6V |
Access Time | 7.5 ns |
Operating Temperature | -40°C~85°C TC |
Clock Frequency | 104MHz |
Memory Size | 4Mb 512K x 8 |
Page Size | 256B |
Density | 32 Mb |
Length | 4.925mm |
Organization | 4MX1 |
Write Cycle Time – Word, Page | 8μs, 2.5ms |
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