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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 12 Weeks |
| Packaging | Tray |
| Min Operating Temperature | -40°C |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Published | 2010 |
| Number of Logic Blocks (LABs) | 24 |
| Max Frequency | 100MHz |
| Max Operating Temperature | 100°C |
| Frequency | 80MHz |
| Speed | 80MHz |
| Core Architecture | ARM |
| Operating Temperature | -40°C~100°C TJ |
| Number of Pins | 208 |
| RAM Size | 64kB |
| Core Processor | ARM? Cortex?-M3 |
| Architecture | MCU, FPGA |
| Peripherals | DMA, POR, WDT |
| Package / Case | 208-BFQFP |
| Supplier Device Package | 208-PQFP (28×28) |
| Flash Size | 512KB |
| Series | SmartFusion? |
| Primary Attributes | ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Connectivity | Ethernet, I2C, SPI, UART/USART |
| Base Part Number | A2F500M3G |
| Number of I/O | MCU – 22, FPGA – 66 |
| Interface | Ethernet, I2C, SPI, UART, USART |
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