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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Speed Grade | 1 |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |
Factory Lead Time | 12 Weeks |
Packaging | Tray |
Max Operating Temperature | 85°C |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Logic Blocks (LABs) | 24 |
Published | 2009 |
Min Operating Temperature | 0°C |
Frequency | 100MHz |
Speed | 100MHz |
Operating Supply Current | 1mA |
Operating Supply Voltage | 1.5V |
Core Architecture | ARM |
Operating Temperature | 0°C~85°C TJ |
Number of Pins | 484 |
RAM Size | 64kB |
Max Frequency | 120MHz |
Core Processor | ARM? Cortex?-M3 |
Architecture | MCU, FPGA |
Peripherals | DMA, POR, WDT |
Package / Case | 484-BGA |
Supplier Device Package | 484-FPBGA (23×23) |
Flash Size | 512KB |
Number of Gates | 500000 |
Series | SmartFusion? |
Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Number of Registers | 11520 |
Primary Attributes | ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Base Part Number | A2F500M3G |
Number of I/O | MCU – 41, FPGA – 128 |
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