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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | RoHS Compliant |
Surface Mount | YES |
Lead Free | Lead Free |
Packaging | Tray |
Qualification Status | Not Qualified |
Technology | CMOS |
Published | 2011 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 40 |
Factory Lead Time | 2 Weeks |
Terminal Pitch | 1mm |
HTS Code | 8542.39.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
JESD-609 Code | e1 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Supply Voltage | 1.5V |
Operating Supply Voltage | 1.5V |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Subcategory | Field Programmable Gate Arrays |
Frequency | 80MHz |
Core Architecture | ARM |
Length | 23mm |
Width | 23mm |
Operating Temperature | 0°C~85°C TJ |
Operating Supply Current | 7mA |
Number of Terminations | 484 |
Number of Pins | 484 |
Peak Reflow Temperature (Cel) | 250 |
RAM Size | 64kB |
Core Processor | ARM? Cortex?-M3 |
Number of Outputs | 94 |
Architecture | MCU, FPGA |
Peripherals | DMA, POR, WDT |
Max Supply Voltage | 1.575V |
Flash Size | 256KB |
Package / Case | 484-BGA |
Min Supply Voltage | 1.425V |
Height Seated (Max) | 2.44mm |
Number of Logic Elements/Cells | 2500 |
Memory Size | 4.5kB |
Number of Gates | 200000 |
Series | SmartFusion? |
Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Data Rate | 400 kbps |
Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Base Part Number | A2F200 |
Primary Attributes | ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Power Supplies | 1.51.82.53.3V |
Number of I/O | MCU – 41, FPGA – 94 |
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