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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusRoHS Compliant
PackagingTray
Min Operating Temperature-40°C
Factory Lead Time16 Weeks
Moisture Sensitivity Level (MSL)3 (168 Hours)
Max Frequency100MHz
Published1997
Max Operating Temperature100°C
Operating Supply Voltage1.5V
Number of Pins256
Frequency80MHz
Speed80MHz
Core ArchitectureARM
Operating Supply Current7mA
Operating Temperature-40°C~100°C TJ
RAM Size64kB
Core ProcessorARM? Cortex?-M3
ArchitectureMCU, FPGA
PeripheralsDMA, POR, WDT
Max Supply Voltage1.575V
Package / Case256-LBGA
Flash Size256KB
Min Supply Voltage1.425V
Number of Logic Elements/Cells2500
Supplier Device Package256-FPBGA (17×17)
Memory Size4.5kB
Number of Gates200000
SeriesSmartFusion?
ConnectivityEBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate400 kbps
InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART
Base Part NumberA2F200
Primary AttributesProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of I/OMCU – 25, FPGA – 66

Manufacturer introduction

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